10th International Conference on Electrical and Electronics Engineering (EEEN 2026)

Program Committee

Accepted Papers

Virtual Conference

Scope
10^th International Conference on Electrical and Electronics Engineering (EEEN 2026) marks a significant milestone in bringing together global researchers, innovators and industry practitioners to exchange knowledge, present breakthroughs and explore emerging trends across the rapidly evolving landscape of Electrical, Electronics, Instrumentation and Communication Engineering. Over the past decade, EEEN has established itself as a vibrant forum for advancing foundational theories, pioneering technologies and transformative applications that shape modern engineering systems.

Call for Papers

EEEN 2026 continues this tradition by providing a premier platform for showcasingoriginal research contributions, cutting edge developments and state of the art reviews spanning both established and emerging domains. The conference aims to foster interdisciplinary collaboration, stimulate new ideas and accelerate innovation in areas such as advanced semiconductor technologies, intelligent systems, power and energy engineering, next generation communication networks, robotics, embedded systems and biomedical technologies.

Researchers, academicians, industry experts and practitioners are encouraged to submit high quality papers that advance theory, enhance practice, or bridge the gap between research and real world applications.

Topics of interest include, but are not limited to, the following

Next Generation Electronics, Devices and Materials

Advanced Semiconductor Devices
VLSI, 3D ICs and Heterogeneous Integration
Advanced Packaging andChiplet Architectures
Nanoelectronics and Quantum Devices
Silicon Photonics and Optoelectronics
Flexible, Wearable and Bio Integrated Electronics

Power Electronics, Energy Systems and Sustainability

Power Electronics and Integrated Power Modules
Electric Vehicles, Charging and Transportation Electrification
Smart Grids, Microgridsand DER Integration
Energy Storage, Battery Systems and Digital Twins
High Voltage Engineering and Protection
Sustainable and Carbon Aware Energy Systems

AI, Computing Systems and Intelligent Hardware

AI Hardware Acceleration
AI Driven Electronic Design Automation (AI EDA)
Generative AI for Engineering and System Design
Edge AI, TinyMLand Low Power Intelligence
High Performance and Cloud Scale Computing
Bio Inspired and Neuromorphic Computing
Secure and Trusted Hardware
Sustainable and Green Computing

Signal Processing, Machine Learning and Data Intelligence

Advanced Signal, Image and Speech Processing
ML/AI for Engineering Systems
Optimization, Metaheuristics and Intelligent Algorithms
Data Fusion, Multimodal Analytics and Digital Twins

Communication Systems, Networks and 6G Technologies

6G and Beyond Wireless Systems
AI Native Wireless Networks
Joint Communication and Sensing (JCAS / ISAC)
RF, mmWaveand THz Circuits
Optical Communication and Photonic Networks
Satellite, UAV and Space Communications

Cybersecurity, Networks and Information Systems

Network Security and Privacy
Cybersecurity for Embedded and CPS
Secure Federated Learning and Distributed AI
Resilient Network Architectures

Robotics, Automation and Cyber Physical Systems

Autonomous Robotics and Intelligent Systems
Cyber Physical Systems and Digital Twins
AI Driven Robotics Simulation and Control
Advanced Control Systems
Human–Robot Interaction
Mechatronics and Avionics

Sensing, Instrumentation and Embedded Systems

Smart Sensors andIoT Systems
Embedded and Real Time Systems
Remote Sensing and Geospatial Intelligence
Quantum Sensing and Precision Measurement
Space Electronics and Radiation Hardened Systems

Biomedical Engineering and Healthcare Technologies

Biomedical Signal and Image Processing
Wearable, Implantable and Assistive Devices
Neural Engineering and Brain–Machine Interfaces
AI Enabled Healthcare and Digital Medicine
Bioinformatics and Computational Biology

Electromagnetics, Thermal Management and Emerging Interdisciplinary Areas

Electromagnetic Compatibility and Interference
Thermal Management, Cooling and Reliability
Quantum Communication and Computing
Electro Optic Co Design

Paper Submission

Authors are invited to submit papers through the conference Submission System by May 24, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Emerging Trends in Electrical, Electronics & Instrumentation Engineering: An International Journal (EEIEJ) (Confirmed).

Selected papers from EEEN 2026, after further revisions, will be published in the special issue of the following journal.

Important Dates

Submission Deadline

May 24, 2026

Authors Notification

June 20, 2026

Registration & camera - Ready Paper Due

June 27, 2026

Proceedings

The soft copy of the proceedings will be available on Journal web pages.

The Registration fee is 250 USD for accepted article Authors. Atleast one author of accepted paper is required to register at the full registration rate.